Development of Adaptable Phase Change Material Composites for Advanced Passive Cooling of Processors
J. Environ. Nanotechnol., Volume 15, No 1 (March 2026) pp. 469-477
Abstract
Modern processors and data-centre modules often experience localized thermal spikes due to rapidly fluctuating computational loads, which can negatively affect device reliability, efficiency, and operational stability. Conventional cooling approaches, including air-based active cooling and conventional phase change materials (PCMs), face limitations such as low thermal conductivity, leakage during phase transition, and bulky packaging structures. In this work, a flexible PCM nanocomposite sheet was developed using paraffin wax as the base PCM reinforced with bio-carbon derived from agricultural waste, bentonite nanoclay, and cellulose fibres. The composite was fabricated using a controlled hot-press method to produce thin, adaptable PCM sheets suitable for direct processor surface integration. The hybrid filler system improves heat transfer pathways while suppressing leakage and enhancing mechanical stability. X-ray diffraction analysis confirmed the preservation of the crystalline structure of paraffin within the composite matrix. Differential scanning calorimetry showed a melting temperature of approximately 62.8 ℃ and a crystallization temperature near 59.1 ℃, indicating stable phase-change behavior. Thermal conductivity measurements increased from about 0.25 W m-1 K-1 for pure paraffin to a maximum of 0.95 W m-1 K-1 in the optimized composite. Field emission scanning electron microscopy observations revealed uniform filler dispersion and an interconnected microstructure that enhances thermal transport. The developed sustainable PCM composite demonstrates promising potential for passive cooling of processors and advanced electronic thermal management systems.
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